The mask is the master of chip manufacturing. The requirements for defects are extremely strict and zero defects are required. The defects of the mask are mainly divided into the defects of the mask manufacturing process and the defects generated during the use of the mask, and both types of defects need to be detected in time.
The STROM series uses Die 2 DB-based detection mode for transmitted light and reflected light to identify pattern deviations on the reticle, greatly reducing the false detection rate of manual miss detection.

The TORNADO series of inspection equipment is designed for the optical inspection needs of semiconductor processes. Using advanced graphics processing technology and imaging system, it has the characteristics of high detection, high speed and flexible application, which can be used for yield control in wafer, thin film circuits, optical devices, MEMS, OLED and other fields.

In the process of making masks and wafers, it is necessary to control the line width Critical Dimension (CD) in real time to determine the effectiveness of the process. CD measurement tools are indispensable. The CD measurement of VPTek is mainly for ADI and AEI's line width process control.
VPTek uses advanced High precision Sub-pixel Line-Fitting Algorithm technology and High precision Sub-pixel Derivative Algorithm for accurate gray boundary determination.

There are many steps in the semiconductor process, and it is necessary to perform multiple photolithography and carry out subsequent process processes, thus engraving between layers. The pattern remaining in the photoresist after exposure and development (referred to as the current layer) must be aligned with the existing pattern on the wafer substrate (referred to as the reference layer) to ensure that the various parts of the device are The connection is correct. Too much alignment error is one of the main causes of short-circuit and open-circuit of the device, which greatly affects the yield of the device.